When soft soldering, is nitrogen required to sweep through the lines to prevent oxidation?

When soft soldering, it is generally not required to sweep nitrogen through the lines to prevent oxidation. The soldering process itself typically does not create conditions that lead to significant oxidation, especially when appropriate fluxes are used. These fluxes serve to prevent oxidation of the metal surfaces being joined and help in the solder flow.

While nitrogen is often utilized in processes like brazing or welding where high temperatures are involved, it is not a necessity in soft soldering, where the soldering occurs at lower temperatures. Thus, the use of nitrogen for oxidation prevention does not apply in the same way as it does for higher temperature processes.

Other options mention specific scenarios or processes (such as brazing or using copper tubing), but soft soldering with proper techniques and materials does not necessitate nitrogen sweeping for oxidation control.